NAND Flash Memory News

Related Semiconductors Industry News

• May 2023 - ANELLO Photonics announced a partnership with NVIDIA Inception to nurture startups revolutionizing industries with technology advancements. The company is focused on building low-noise and low-drift optical gyroscope smart sensors leveraging ANELLO's patented photonic integrated circuit technology.
• August 2022 - DustPhotonics announced a partnership with MaxLinear to demonstrate a silicon photonics chipset with integrated lasers directly driven from a DSP without the use of any external driver chip, providing exceptional total system performance.
• March 2022 - Source Photonics announced the sampling of its Silicon-Photonics 400G DR4 QSFP56-DD products at OFC 2022 from March 6-10. The Silicon-Photonic 400G DR4 transceivers are designed to work seamlessly with the company's pump laser chip. They exceed the specifications for IEEE 802.3bs 400GBASE-DR4 optical interface and 400GAUI-8 electrical client interface. They support links over 500m and 2km for a breakout into 100GBASE-DR1 and 100GBASE-FR1. They also leverage the 7nm DSP with 8W typical power consumption and are packaged into a type 2 QSFP-DD form factor with an MPO-12 connector.

• June 2022 - Taiwan's GlobalWafers Co Ltd announced spending USD 5 billion on a new plant in Texas to make 300-millimeter silicon wafers used in semiconductors. With the global chip shortage and ongoing geopolitical concerns, GlobalWafers is taking this opportunity to address the resiliency of the United States semiconductor supply chain.
• April 2022 - Shin-Etsu Chemical Co. Ltd declared that the pricing of all of its silicone goods would increase by 10%, and one of Shin-core Etsu's business areas would be raised in Japan and across the world. As a result, the significant price rise is still going on. Furthermore, transportation costs are increased in both the acquisition of raw materials and the distribution of finished goods.

• May 2023: Infineon Technologies AG launched the OptiMOS7 40V MOSFET family, its latest generation of power MOSFETs for automotive applications in various lead-free and robust power packages. The new family combines 300 mm thin-wafer technology with innovative packaging to deliver significant performance benefits in tiny packages. It makes the MOSFETs ideal for all standard and future automotive 40V MOSFET applications, such as electric power steering, braking systems, disconnect switches new zone architectures.
• May 2023: Toshiba Electronics Europe launched a new 150V N-channel power MOSFET based upon their latest generation U-MOS X-H Trench process. The TPH9R00CQ5 is specifically designed for high-performance switching power supplies such as those used in communication base stations and other industrial applications.

• September 2022 - Infineon Technologies AG launched a new line of OptiMOS 5 IPOL buck regulators with VR14-compliant SVID and I2C/PMBus digital interfaces for Intel/AMD server CPUs and network ASICs/FPGAs. These devices, which are housed in a 5 x 6 mm2 PQFN package, are a simple, fully integrated, and highly efficient solution for next-generation server, storage, telecom, and datacom applications, as well as distributed power systems.
• February 2022 - ASIC design service and IP leader Faraday Technology Corporation reported that it had completed a number of Factory Automation ASIC projects, mostly in the area of industrial IoT (IIoT). These designs, which use the 8" and 12" wafer process technologies, integrate industrial robot applications, PLC processors, controllers, and communication. In addition to offering excellent reliability to satisfy industry standards, they delivered long-term supply promises to their clients.

• November 2022: Hua Hong Semiconductor Ltd received regulatory approval for USD 2.5 billion IPO in Shanghai. The planned initial public offering (IPO) comes as China’s chip companies gear up for steeper competition with the United States due to geopolitical tensions. Due to this, Hua Hong intends to use the money to invest in a new fabrication plant - or fab - in the eastern city of Wuxi, with construction set to begin in 2023 and an eventual production capacity of 83,000 wafers per month.
• October 2022: Siemens partnered with TSMC for 3 nm product certifications and other technology milestones. Siemens is pleased to extend this partnership with the recent certifications of Siemens’ design platforms for TSMC’s newest and most advanced semiconductor process technologies. Siemens’ long and prolific partnership with TSMC continues to help its joint customers deliver highly innovative and differentiated ICs.
• September 2022: United Microelectronics Corporation (UMC) and Avalanche Technology, a next-generation MRAM technology provider, launched new high-reliability persistent SRAM (P-SRAM) memory devices. The new device will be integrated with UMC’s 22nm process technology and based on Avalanche Technology’s latest generation of Spin Transfer Torque Magnetoresistive RAM (STT-MRAM) technology. In line with this launch, the company will offer its customers significant density, reliability, endurance, and power benefits over existing non-volatile solutions.

• September 2022 - Showa Denko K.K. (SDK) announced its merger with Showa Denko Materials Co., Ltd. (SDMC) on January 1, 2023, to form "Resonac." Resonac Holdings Corporation will replace SDK as a holding company, while Resonac Corporation will replace SDMC as an operational corporation. Through ongoing restructuring efforts, the Showa Denko Group intends to establish a major chemical firm with cutting-edge functional materials.
• August 2022 - Indium Corporation introduced products from its GalliTHERM line of gallium-based liquid metals solutions. The company's over 60 years of expertise in producing liquid metals based on gallium are incorporated into this cutting-edge product range.

• October 2022: Micron Technology Inc. intended to invest up to USD 100 billion over the coming 20-plus years to construct a new mega fab in Clay, New York, with the first phase investment of USD 20 billion planned by the end of the following decade. Micron’s New York mega fab is part of its strategy to gradually increase American-made leading-edge DRAM production to 40% of its global output over the next decade. Micron’s DRAM production in the United States brings tremendous benefits to its customers, enabling them to build innovative products.
• June 2022: NXP Semiconductors NV announced new processor families that extend the benefits of the company's innovative S32 automotive platform with high-performance real-time processing and safety. The S32E and S32Z and processor families help enable the automotive industry to accelerate the integration of diverse real-time applications for domain and zonal control, safety processing, and vehicle electrification that are critical to the next generation of safer and more efficient vehicles.
• June 2022: Renesas Electronics Corporation developed circuit technologies for 22-nm embedded STT-MRAM with faster read and write execution for microcontrollers in IoT applications. The test chip includes a 32-megabit embedded MRAM memory cell array and executes 5.9-nanosecond random read credentials at a maximum junction temperature of 150°C and a write throughput of 5.8-megabyte-per-second.

• May 2022: A 200 mm (8′′) epiwafer for vertical-cavity surface-emitting laser (VCSEL) diodes was created by IQE in Wales. The cost of the laser for 3D sensors is expected to be drastically reduced by switching to a 200 mm compound semiconductor epi wafer. New foundry relationships may result from this, particularly those with high-volume silicon-based foundries that use 200 mm machinery. This may make it possible for compound semiconductors to be integrated into silicon, opening up a wider choice of devices and applications.
• May 2022 - JX Nippon Mining & Metals Corporation company concluded a financing agreement with the Japan Bank for International Cooperation to procure the funding needed to strengthen its business in the manufacturing of sputtering targets for semiconductors in the United States of America.

• June 2022: RIBER, a global market player for molecular beam epitaxy (MBE) equipment serving the semiconductor industry, announced an order for a multi-4' GSMBE 49 production system. The new generation of datacom devices requires highly precise control of the epitaxial growth process, which is achieved by the recognized performance of Riber's machines and by the sophistication of the machine's control software. The ordered machine is expected to be delivered in 2023.​
• June 2022: Veeco announced that the Taiwan semiconductor research institute, National Applied Research Laboratories, selected Veeco’s propel R&D Metal Organic Chemical Vapor Deposition System. The single wafer platform is ideal for high-volume manufacturing, 300 mm capabilities, and research and development applications.

• August 2022 - SK hynix announced its plans to mass-produce the industry‘s first 238-layer four-dimensional NAND flash memory in the first half of 2023. 
• December 2021 - Floadia announced to have developed a flash memory that can store seven bits of data per cell (7bpc) for ten years at 150°C. Floadia's new memory can store more charges per cell and has longer retention than regular flash memory so that it can store data without power for longer periods.
• June 2021 - Micron Technology unveiled recent memory and storage products that can serve data-driven businesses as the data economy continues to develop. The new flash memory and dynamic random-access memory (DRAM) chips were designed to deal with the bottleneck in feeding data between memory, storage, and processing solutions in modern computers.